Guide TIMO Thermal Imaging Module
Application field：
ThermographyIndustrial processSmart home
The wafer-level package infrared module integrates wafer-level optical lens, wafer-level package detector, and basic imaging processing circuit to achieve accurate temperature data and sharp images for each pixel in the full frame, enabling easy integration into mobile terminals or smart devices, especially innovative products with strict requirements on cost, size and weight.
Model | 120 Module(50°) | 120 Module(120°) |
Performance Parameter | ||
Sensor type | VOx Microbolometer | |
Resolution | 120X90 | |
Pixel Pitch | 17μm | |
Spectral Range | LWIR, 8~14μm | |
NETD | <60mK | |
Optics Type | Wafer-level Optics | |
Focus | Fixed | |
HFOV | 50° | 120° |
Depth of Field | 10cm to infinity | |
Frame Rate | 1-30Hz(Controllable) | |
Output Format | Raw14 | |
Output Format | Nonuniformity | |
Temperature range | -20°C~ ＋120°C (standard) | |
Temperature range can be extended to 400°C | ||
Interface/Control | ||
AVDD | 3.6V±0.05V | |
VSK | 4.7V | |
DVDD | 1.8V±0.05V | |
Interface | Digital Interface | |
Power consumption | 45mw (Typical Value)， 9mw (Low Power Mode) | |
Physical Characteristics | ||
Dimension(mm) | 8.5X8.5X9.16 | 8.5X8.5X5.5 |
Operation Temperature | -20°C~ ＋60°C | |
Storage Temperature | -40°C~ ＋85°C | |
Humidity | <85%RH | |
Coming soon